Product novelty 19. September 2023
BIZON push in contact with incredible flexibility in material thickness 0,4 mm - 1,5 mm
We can give you broad-ranging design flexibility in terms of material selection, material thickness, material strength and adaptability to your specific needs and technical requirements. Made to measure exactly to the customer's needs.
Providing BIZON® press-fit technology, ZETKA offers an innovative solderless contacting system for all requirements in the automotive supply industry, electrical engineering, power electronics and any other application where secure contact connection to a printed circuit board or metal plate defines the quality of the final product.
This press-fit technology is a solder-free, robust, secure electrical connection technology in which preferably elastic, formable pins are connected into metallised (copper-plated) printed circuit board holes with defined dimensions at a defined speed using a press-fit facility. This produces a permanent gas-tight mechanical and electrically low-resistance connection (cold welding) at the contact surfaces between the press-fit pin and the hole's metallic inner wall. The unique spring properties of the BIZON® press-fit contact prevent any damage to the printed circuit board if the press-fit process is carried out correctly.
The key aspect and major benefit of BIZON® press-fit technology lies in providing the greatest possible square cross-section with accurate self-centring in the PCB hole. The conductor cross-section this achieves is approx. 72% of the hole cross-section, permitting a high electrical strength per contact. With its four defined contact areas, each BIZON® contact provides maximum contact surfaces and, as such, outstanding and secure contact properties.
Depending on the application, you can avoid unnecessary cost and time-intensive surface finishes in the press-fit zone by using bare BIZON® contacts. This prevents the formation of whiskers and tin chips which can lead to failure of the entire assembly down the line.
Providing BIZON® press-fit technology, ZETKA offers an innovative solderless contacting system for all requirements in the automotive supply industry, electrical engineering, power electronics and any other application where secure contact connection to a printed circuit board or metal plate defines the quality of the final product.
This press-fit technology is a solder-free, robust, secure electrical connection technology in which preferably elastic, formable pins are connected into metallised (copper-plated) printed circuit board holes with defined dimensions at a defined speed using a press-fit facility. This produces a permanent gas-tight mechanical and electrically low-resistance connection (cold welding) at the contact surfaces between the press-fit pin and the hole's metallic inner wall. The unique spring properties of the BIZON® press-fit contact prevent any damage to the printed circuit board if the press-fit process is carried out correctly.
The key aspect and major benefit of BIZON® press-fit technology lies in providing the greatest possible square cross-section with accurate self-centring in the PCB hole. The conductor cross-section this achieves is approx. 72% of the hole cross-section, permitting a high electrical strength per contact. With its four defined contact areas, each BIZON® contact provides maximum contact surfaces and, as such, outstanding and secure contact properties.
Depending on the application, you can avoid unnecessary cost and time-intensive surface finishes in the press-fit zone by using bare BIZON® contacts. This prevents the formation of whiskers and tin chips which can lead to failure of the entire assembly down the line.
ZETKA Stanz- und Biegetechnik
AG & Co. KG
Contact
Mr. Richard Riexinger